4th International Summer School on Smart Materials & Structures - A cross-disciplinary perspective
Registrations are open! (see "online registration form" on your right)
Radical developments in material science, telecommunications and sensor technologies are about to transform the way of engineering design, are conceived and carried out. Indeed, within the next ten years smart materials and structures, with embedded sensors and systems capable of self-diagnosis, will be part of our life, from simple goods to civil buildings. These elements will be permanently connected to a distributed management network so that owners, users, and in general, all those involved in the production/management process - connected via the Internet - can check element conditions during production, transport, installation and operation.
The scope of the School is to provide an overview of smart technologies from a cross-disciplinary perspective with special focus on smart materials, nano- and micro-technologies, wireless sensor networks, autonomous mobile sensors, fiber optic sensors, control devices, NDT evaluation, decision making.
Dennis Bernal (Northeastern University, USA)
Branko Glisic (Princeton University, USA)
Kenneth J. Loh (University of California, Davis, USA)
Satish Nagarajaiah (Rice University, USA)
Wieslaw Ostachowicz (Polish Academy of Sciences, Poland)
Matteo Pozzi (Carnegie Mellon University, USA)
Hoon Sohn (KAIST, Korea)
Yang Wang (Georgia Tech, USA)
Who should attend
Graduate students and post-doc researchers pursuing research in the field of new technologies applied to structural health monitoring and control.
Meet the experts in the field at the Summer School, shear your research at IEEE EESMS!
The 4th Int’l Summer School on Smart Materials & Structure is a joint event with the 2015 IEEE Workshop on Environmental, Energy and Structural Monitoring Systems (EESMS). Registration to the Summer School includes free participation to the 2015 IEEE EESMS!
The School offers 10 scholarships to support participation of international students by covering registration fee. Apply for a Scholarship.